TDA4866 데이터 시트보기 (PDF) - Philips Electronics

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TDA4866

Full bridge current driven vertical deflection booster

Philips Electronics 

Philips Semiconductors

Full bridge current driven vertical deflection

booster

Product specification

TDA4866

SOLDERING

Introduction to soldering through-hole mount

packages

This text gives a brief insight to wave, dip and manual

soldering. A more in-depth account of soldering ICs can be

found in our “Data Handbook IC26; Integrated Circuit

Packages” (document order number 9398 652 90011).

Wave soldering is the preferred method for mounting of

through-hole mount IC packages on a printed-circuit

board.

Soldering by dipping or by solder wave

The maximum permissible temperature of the solder is

260 °C; solder at this temperature must not be in contact

with the joints for more than 5 seconds.

The total contact time of successive solder waves must not

exceed 5 seconds.

The device may be mounted up to the seating plane, but

the temperature of the plastic body must not exceed the

specified maximum storage temperature (Tstg(max)). If the

printed-circuit board has been pre-heated, forced cooling

may be necessary immediately after soldering to keep the

temperature within the permissible limit.

Manual soldering

Apply the soldering iron (24 V or less) to the lead(s) of the

package, either below the seating plane or not more than

2 mm above it. If the temperature of the soldering iron bit

is less than 300 °C it may remain in contact for up to

10 seconds. If the bit temperature is between

300 and 400 °C, contact may be up to 5 seconds.

Suitability of through-hole mount IC packages for dipping and wave soldering methods

PACKAGE

DBS, DIP, HDIP, SDIP, SIL

suitable

DIPPING

SOLDERING METHOD

suitable(1)

WAVE

Note

1. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.

2001 Aug 07

15

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