ADF7021-V
OUTLINE DIMENSIONS
7.00
BSC SQ
PIN 1
INDICATOR
TOP
VIEW
0.60 MAX
0.60 MAX
37
36
0.30
0.23
0.18
48
1
PIN 1
INDICATOR
6.75
BSC SQ
EXPOSED
PAD
(BOTTOM VIEW)
4.25
4.10 SQ
3.95
1.00 12° MAX
0.85
0.80
SEATING
PLANE
0.50
0.40
25
0.30
24
0.80 MAX
0.65 TYP
0.50 BSC
0.05 MAX
0.02 NOM
0.20 REF
COPLANARITY
0.08
5.50
REF
12
13
0.25 MIN
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
COMPLIANT TO JEDEC STANDARDS MO-220-VKKD-2
Figure 78. 48-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
7 mm × 7 mm Body, Very Thin Quad
(CP-48-3)
Dimensions shown in millimeters
ORDERING GUIDE
Model1
ADF7021-VBCPZ
ADF7021-VBCPZ-RL
EVAL-ADF70XXMBZ2
EVAL-ADF7021-VDB1Z
EVAL-ADF7021-VDB2Z
1 Z = RoHS Compliant Part.
Temperature Range
−40°C to +85°C
−40°C to +85°C
Package Description
48-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
48-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
Evaluation Platform Mother Board
450 MHz to 470 MHz Daughter Board
868 MHz to 870 MHz Daughter Board
Package Option
CP-48-3
CP-48-3
©2010 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
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