ADP121-ACBZ155R7 데이터 시트보기 (PDF) - Analog Devices
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ADP121-ACBZ155R7 Datasheet PDF : 20 Pages
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140
120
100
80
60
LOAD CURRENT = 1mA
LOAD CURRENT = 10mA
LOAD CURRENT = 25mA
40
LOAD CURRENT = 50mA
LOAD CURRENT = 75mA
LOAD CURRENT = 100mA
20
LOAD CURRENT = 150mA
MAX JUNCTION TEMPERATURE
0
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5
VIN – VOUT (V)
Figure 46. TSOT, 100 mm2 of PCB Copper, TA = 85°C
140
120
100
80
60
LOAD CURRENT = 1mA
LOAD CURRENT = 10mA
LOAD CURRENT = 25mA
40
LOAD CURRENT = 50mA
LOAD CURRENT = 75mA
LOAD CURRENT = 100mA
20
LOAD CURRENT = 150mA
MAX JUNCTION TEMPERATURE
0
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5
VIN – VOUT (V)
Figure 47. WLCSP, 100 mm2 of PCB Copper, TA = 85°C
PRINTED CIRCUIT BOARD LAYOUT
CONSIDERATIONS
Heat dissipation from the package can be improved by increasing
the amount of copper attached to the pins of the ADP121. How-
ever, as can be seen from Table 5 and Table 6, a point of
diminishing returns is eventually reached, beyond which
an increase in the copper size does not yield significant heat
dissipation benefits.
Place the input capacitor as close as possible to the VIN and
GND pins. Place the output capacitor as close as possible to the
VOUT and GND pins. Use 0402 or 0603 size capacitors and
resistors to achieve the smallest possible footprint solution on
boards where area is limited.
ADP121
GND
GND
ANALOG DEVICES
ADP121-xx-EVALZ
C1
C2
U1
J1
VIN
VOUT
GND
EN
GND
Figure 48. Example of TSOT PCB Layout
ADP121CB-xx-EVALZ
VIN
J1
C1
C2
U1
WLC
SP
VOUT
GND
EN
GND
Figure 49. Example of WLCSP PCB Layout
Rev. 0 | Page 17 of 20
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