BA6872AFM 데이터 시트보기 (PDF) - ROHM Semiconductor

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BA6872AFM

3-phase motor driver and reversible motor driver

ROHM Semiconductor 

Motor driver ICs

BA6872AFM

FOperation notes

(1) Thermal shutdown (TSD)

The BA6872AFM has a thermal shutdown circuit to pro-

tect the IC. The shutdown temperature is 175 _C

(Typ.) and the hysteresis width is 65_C (Typ.).

When the circuit is activated due to an increase in the

chip temperature, the output pins (pins 5, 6, and 9) are

set to the open state. This circuit is functional against ex-

cessive power dissipation, output short-circuiting, and

other irregularities in the output current, but does not

work against overheating caused by high internal cur-

rents due to externally-caused IC damage, or pin-to-pin

shorting.

(2) Hall input

The Hall input circuit is shown in (1) on the I / O circuits.

Hall devices can be connected either in series or in paral-

lel. Be sure to keep the Hall input within the range 1.5V

to (VCC * 1.8V).

(3) Setting pin for the output high-level voltage (Vref)

The voltage applied to the setting pin for the output high-

level voltage should not exceed the VM2 voltage. Con-

nect this to VM2 when not using it.

When the Vref pin is connected to a low impedance cir-

cuit for voltage setting, there is a chance that the output

voltage may oscillate.

When setting the voltage, set it via an impedance, or con-

nect a capacitor between Vref and GND.

The impedance and capacitor values will differ depend-

ing on the motor type, PCB pattern, and load current, so

test the values using your actual circuit.

(4) GND

The GND (pin 8) potential must be kept below that of the

other pins at all times. The thermal dissipation FIN is in-

ternally connected to pin 8. Take care regarding handling

of FIN.

(5) Input pins

Do not apply voltage to the inputs when VCC is not being

supplied. Also, in the same way, even if VCC is being sup-

plied, the inputs must be either at or below the VCC level.

(6) Back-rush voltage

The back-rush voltage will vary depending on the operat-

ing conditions, environment, and motor characteristics.

Take care to ensure that the back-rush voltage does not

interfere with the operation of the IC.

(7) Large current lines

Large currents flow in the power supply and GND lines

of this IC. Therefore, depending on the PCB pattern lay-

out and the values of external circuit components con-

nected between the power supply and GND such as ca-

pacitors, this large current can be returned to the input,

and cause incorrect operation and oscillation. To avoid

this, carefully check the PCB layout and the values of all

circuit components.

(8) The power dissipation of the IC depends on how it

is mounted. Perform thermal design carefully.

(9) Power consumption

The power dissipated by the IC varies widely with the ap-

plied voltage and output current. Pay close attention to

the allowed power dissipation, and base your thermal de-

sign on the thermal resistance data and transient thermal

resistance data to ensure that the ratings are not exceed-

ed.

(10) ASO

Make sure that the output current and supply voltage do

not exceed the ASO values.

(11) Input mode switching

To improve reliability, when switching modes, first switch

to the open mode.

830

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