BGA2012 데이터 시트보기 (PDF) - Philips Electronics
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BGA2012 Datasheet PDF : 12 Pages
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Philips Semiconductors
1900 MHz high linear low noise amplifier
APPLICATION INFORMATION
Product specification
BGA2012
handbook, full pagewidth
VC
VC
BIAS
CIRCUIT
C5
RF in
C1
L1
IN
SOT363
VS
C4
L2
VS
C3
OUT
C2
RF out
MLD470
GND
C6
stripline
Fig.2 Application circuit.
List of components (see Fig.2)
COMPONENT
DESCRIPTION
C1, C2
C3, C5
C4
C6
L1
L2
multilayer ceramic chip capacitor
multilayer ceramic chip capacitor
multilayer ceramic chip capacitor
multilayer ceramic chip capacitor
SMD inductor
SMD inductor
TYPICAL
APPLICATION
100 pF
22 nF
−
−
−
−
HIGH IP3
APPLICATION
100 pF
22 nF
−
100 nF
3.9 nH
3.9 nH
DIMENSIONS
0603
0603
−
0805
0603
0603
Note
1. The stripline (w = 0.7 mm) is on a gold plated double copper-clad printed-circuit board (εr = 6.15),
board thickness = 0.64 mm, copper thickness = 35 µm, gold thickness = 5 µm.
2000 Dec 04
4
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