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SY87701LZI 데이터 시트보기 (PDF) - Micrel

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SY87701LZI Datasheet PDF : 14 Pages
First Prev 11 12 13 14
Micrel, Inc.
32 LEAD EPAD TQFP (DIE UP) (H32-1)
SY87701L
Package
EP- Exposed Pad
Die
CompSide Island
Heat Dissipation
Heat Dissipation
VEE
Heavy Copper Plane
VEE
Heavy Copper Plane
PCB Thermal Consideration for 32-Pin EPAD-TQFP Package
Rev. 01
M9999-111506
hbwhelp@micrel.com or (408) 955-1690
13

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