DF19-8P-1SD 데이터 시트보기 (PDF) - HIROSE ELECTRIC

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DF19-8P-1SD

1 mm Contact Pitch, Board-to-Cable, Board-to-FPC, Board-to-Micro-coaxial Cable Connectors

HIROSE ELECTRIC 

The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.

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BUse recommendations

1. Recommendedtemperature profile

Temperature(ç)

250ç

200ç

150ç

100ç

50ç

220

180

Preheating

60 to 120(S)

soldering

250ç 10(s)max

220ç min 60(s)max

2. Manual soldering

3. Screen thickness

4. Board warpage

5. Cleaning conditions

6. Termination conditions

7. Precautions

8. Precautions

30 50

100

150

200 TIME(S)

Note 1: Up to 2 cycles of Reflow soldering are possible under the same

conditions, provided that there is a return to normal temperature

between the first and second cycle.

Note 2: The temperature profile indicates the board surface temperature at

the point of contacts with the connector terminals.

Note 3: The product can be used without trouble though the surface of a

grounding plate might discolor.

Manual soldering: 290±10ç for 3 seconds

0.15mm

Maximum of 0.03mm at the connector center, with both ends of the connector as

reference points.

Refer to “Nylon Connector Use Handbook.”

Refer to “Nylon Connector Use Handbook.”

■ Do not twist when mating/un-mating.

Refer to “Nylon Connector Use Handbook.”

B264

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