EL5111, EL5211, EL5411
HMSOP (Heat-Sink MSOP) Package Family
E
B
E1
0.25 M C A B
MDP0050
HMSOP (HEAT-SINK MSOP) PACKAGE FAMILY
SYMBOL HMSOP8 HMSOP10 TOLERANCE
1
N
A
1.00
1.00
Max.
NOTES
-
D
(N/2)+1
A1
0.075
0.075
+0.025/-0.050
-
A2
0.86
0.86
±0.09
-
(N/2)
PIN #1
A
I.D.
TOP VIEW
b
0.30
0.20
+0.07/-0.08
-
c
0.15
0.15
±0.05
-
D
3.00
3.00
±0.10
1, 3
D1
1.85
1.85
Reference
-
EXPOSED
E2
THERMAL PAD
E
4.90
4.90
±0.15
-
E1
3.00
3.00
±0.10
2, 3
E2
1.73
1.73
Reference
-
e
0.65
0.50
Basic
-
D1
L
0.55
0.55
±0.15
-
L1
0.95
0.95
Basic
-
BOTTOM VIEW
C
SEATING
PLANE
0.10 C
N LEADS
e
H
b
SIDE VIEW
0.08 M C A B
N
8
10
Reference
-
NOTES:
Rev. 0 10/03
1. Plastic or metal protrusions of 0.15mm maximum per side are not
included.
2. Plastic interlead protrusions of 0.25mm maximum per side are
not included.
3. Dimensions “D” and “E1” are measured at Datum Plane “H”.
4. Dimensioning and tolerancing per ASME Y14.5M-1994.
L1
A
c
END VIEW SEE DETAIL "X"
GAUGE
0.25 PLANE
L
3° ±3°
DETAIL X
A2
A1
17
FN7119.5
January 10, 2007