EL5411T(2010) 데이터 시트보기 (PDF) - Intersil
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EL5411T Datasheet PDF : 16 Pages
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EL5411T
Thermal Shutdown
The EL5411T has a built-in thermal protection which
ensures safe operation and prevents internal damage to
the device due to overheating. When the die temperature
reaches +165°C (typical) the device automatically shuts
OFF the outputs by putting them in a high impedance
state. When the die cools by +15°C (typical) the device
automatically turns ON the outputs by putting them in a
low impedance (normal) operating state.
Power Supply Bypassing and Printed Circuit
Board Layout
The EL5411T can provide gain at high frequency, so good
printed circuit board layout is necessary for optimum
performance. Ground plane construction is highly
recommended, trace lengths should be as short as
possible and the power supply pins must be well
bypassed to reduce any risk of oscillation.
For normal single supply operation (the VS- pin is
connected to ground) a 4.7µF capacitor should be placed
from VS+ to ground, then a parallel 0.1µF capacitor
should be connected as close to the amplifier as possible.
One 4.7µF capacitor may be used for multiple devices.
For dual supply operation the same capacitor
combination should be placed at each supply pin to
ground.
It is highly recommended that EL5411T exposed thermal
pad packages should always have the pad connected to
the lowest potential, VS-, to optimize thermal and
operating performance. PCB vias should be placed below
the device’s exposed thermal pad to transfer heat to the
VS- plane and away from the device.
13
FN6837.2
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