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EL7515(2005) 데이터 시트보기 (PDF) - Intersil

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EL7515
(Rev.:2005)
Intersil
Intersil Intersil
EL7515 Datasheet PDF : 9 Pages
1 2 3 4 5 6 7 8 9
MSOP Package Information
EL7515
0.25
CAB
N
E
E1
A
(N/2)+1
Pin #1
I.D. Mark
A2
A1
L
DETAIL X
Gauge
Plane
0.25
3×±3×
1
B
e
C
Seating
Plane
b
0.10 C
N Leads
(N/2)
H
L1
0.08
CA B
c
See Detail "X"
DIMENSION TABLE
Symbol MSOP8 MSOP10 Tolerance
A
1.10
1.10
MAX.
A1
0.10
0.10 +/- 0.05
A2
D (1) (3)
0.86
3.00
0.86 +/- 0.09
3.00 +/- 0.10
E
4.90
4.90 +/- 0.15
A
E1 (2) (3)
3.00
3.00 +/- 0.10
L
0.55
0.55 +/- 0.15
L1
0.95
0.95
Basic
b
0.33
0.23
+0.07/-0.08
c
0.18
0.18 +/- 0.05
e
0.65
0.50
Basic
N
8
10
Reference
Drawing #: MDP0043
Rev: C
Date: 6/14/99
Units: mm
JEDEC Reg: MO-187
PACKAGE OUTLINE DRAWING
MINI SO PACKAGE (MSOP) PACKAGE FAMILY
HIGH PERFORMANCE ALONGA INTEGRATED CIRCUITS
Semiconductor, Inc.
Notes:
(1) Plastic or metal protrusions of 0.15 mm
maximum per side are not included.
(2) Plastic interlead protruosins of 0.25 mm
maximum per side are not included.
(3) Dimensions "D" and "E1" aremeasured
at Datum Plane "H".
(4) Dimensioning and tolerancing per
ASME Y14.5M-1994.
NOTE: The package drawing shown here may not be the latest version. To check the latest revision, please refer to the Intersil
website at <http://www.intersil.com/design/packages/index.asp>
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
9
FN7120.1
May 13, 2005

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