EMIF08-VID01C2 데이터 시트보기 (PDF) - STMicroelectronics

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EMIF08-VID01C2

8 line low capacitance EMI filter and ESD protection

STMicroelectronics 

2 Ordering information scheme

EMIF08-VID01C2

2 Ordering information scheme

EMIF vv - xxx zz C y

EMI Filter

Number of lines

X: resistance (Ohms)

Z: capacitance value / 10 pF

or

Application (3 letters) and

Version (2 digits)

C: Coated flip chip

1: Pitch = 500 µm, Bump = 315 µm

2: Lead free Pitch = 500 µm, Bump = 315 µm

3 Package mechanical data flip chip

500µm +/-50

315 µm +/- 50

250µm +/-50

695µm +/- 70

3.92 mm +/-50µm

Figure 7. Marking

Dot, ST Logo

xx = marking

z = packaging

location

yww = date code

Dimensions in

365

240

®E

xxz

y ww ww

Figure 8. Foot print receommendation

Copper pad Diameter :

250µm recommended , 300µm max

Solder stencil opening : 330µm

Solder mask opening recommendation :

340µm min for 300µm copper pad diameter

4/6

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