ESDALC6V1F2 데이터 시트보기 (PDF) - STMicroelectronics
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ESDALC6V1F2 Datasheet PDF : 7 Pages
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Ordering information
Figure 11. Flip-Chip tape and reel specifications
Dot identifying Pin A1 location
4 ± 0.1
ESDALC6V1F2
Ø 1.5 ± 0.1
ST E
xxz
yww
ST E
xxz
yww
ST E
xxz
yww
0.73 ± 0.05
4 ± 0.1
All dimensions in mm
User direction of unreeling
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
4
Ordering information
Table 5. Ordering information
Part number
Marking
Package
ESDALC6V1F2
ED
Flip-Chip
Weight
2.1 mg
Base qty
5000
Delivery mode
Tape and reel
5
Revision history
Table 6. Revision history
Date
Revision
Changes
07-Aug-2006
1
Initial release.
11-Jul-2007
2
Updated marking from EDT to ED.
6/7
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