ESDALC6V1P6 데이터 시트보기 (PDF) - STMicroelectronics

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ESDALC6V1P6

ASD (Application Specific Devices) Low capacitance TRANSIL™ arrays for ESD protection

STMicroelectronics 

ESDALC6V1Px

Package information

Table 5. SOT-666IP dimensions

Dimensions

b1

L1

L4

L3

b

D

A

e

Ref.

Millimeters

Inches

Min. Typ. Max. Min. Typ. Max.

A 0.45

0.60 0.018

0.024

A3 0.08

0.18 0.003

0.007

b 0.17

0.34 0.007

0.013

E1

b1 0.19 0.27 0.34 0.007 0.011 0.013

D 1.50

1.70 0.059

0.067

E 1.50

1.70 0.059

0.067

E

L2

A3

E1 1.10

1.30 0.043

0.051

e

0.50

0.020

L1

0.19

0.007

L2 0.10

0.30 0.004

0.012

L3

0.10

0.004

L4

0.60

0.024

Figure 12. SOT-666IP footprint (dimensions in mm)

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a lead-free second level interconnect. The category of

second level interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at: www.st.com.

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