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FDC6324L 데이터 시트보기 (PDF) - Fairchild Semiconductor

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FDC6324L
Fairchild
Fairchild Semiconductor Fairchild
FDC6324L Datasheet PDF : 10 Pages
1 2 3 4 5 6 7 8 9 10
Electrical Characteristics (TA = 25°C unless otherwise noted)
Symbol Parameter
Conditions
Min Typ Max Units
OFF CHARACTERISTICS
IFL
Forward Leakage Current
IRL
Reverse Leakage Current
ON CHARACTERISTICS (Note 3)
VIN = 20 V, VON/OFF = 0 V
VIN = -20 V, VON/OFF = 0 V
1
µA
-1
µA
VIN
VON/OFF
VDROP
IL
Input Voltage
On/Off Voltage
Conduction Voltage Drop @ 1A
Load Current
VIN = 10 V, VON/OFF = 3.3V
VIN = 5 V, VON/OFF = 3.3 V
VDROP = 0.2 V, VIN = 10 V, VON/OFF = 3.3 V
VDROP = 0.3 V, VIN = 5 V, VON/OFF = 3.3 V
3
20
V
1.5
8
V
0.135 0.2
V
0.215 0.3
1
A
1
Notes:
1. VIN=20V, VON/OFF=8V, VDROP=0.5V, TA=25oC
2. RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. RθJC is guaranteed
by design while RθCA is determined by the user's board design.
( ) = = = ( ) × PD t
TJTA
RθJ A(t)
TJTA
RθJ C+RθCA(t)
I
2
D
t
RDS(ON)@TJ
Typical RθJA for single device operation using the board layouts shown below on FR-4 PCB in a still air environment:
a. 180oC/W when mounted on a 2oz minimum copper pad.
2a
Scale 1 : 1 on letter size paper
3. Pulse Test: Pulse Width < 300µs, Duty Cycle < 2.0%
FDC6324L Rev. D

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