FOD2741BSDV 데이터 시트보기 (PDF) - Fairchild Semiconductor
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FOD2741BSDV Datasheet PDF : 15 Pages
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Carrier Tape Specifications
K0
t
W1
D0
P0
P2
E
A0
B0
F
W
d
User Direction of Feed
P
D1
Symbol
W
t
P0
D0
E
F
P2
P
A0
B0
K0
W1
d
R
Description
Tape Width
Tape Thickness
Sprocket Hole Pitch
Sprocket Hole Diameter
Sprocket Hole Location
Pocket Location
Pocket Pitch
Pocket Dimensions
Cover Tape Width
Cover Tape Thickness
Max. Component Rotation or Tilt
Min. Bending Radius
Dimension in mm
16.0 ± 0.3
0.30 ± 0.05
4.0 ± 0.1
1.55 ± 0.05
1.75 ± 0.10
7.5 ± 0.1
4.0 ± 0.1
12.0 ± 0.1
10.30 ±0.20
10.30 ±0.20
4.90 ±0.20
1.6 ± 0.1
0.1 max
10°
30
Reflow Profile
300
245 C, 10–30 s
250
260 C peak
200
150
100
Time above 183C, <160 sec
50
Ramp up = 2–10C/sec
0
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5
Time (Minute)
• Peak reflow temperature: 260 C (package surface temperature)
• Time of temperature higher than 183 C for 160 seconds or less
• One time soldering reflow is recommended
©2004 Fairchild Semiconductor Corporation
FOD2741A, FOD2741B, FOD2741C Rev. 1.0.1
14
www.fairchildsemi.com
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