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GS-R51515S 데이터 시트보기 (PDF) - STMicroelectronics

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GS-R51515S Datasheet PDF : 8 Pages
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GS-R51212S/GS-R51515S
The dissipated power in this operating condition is
about 7.4W (at typical efficiency of 81%), and the
case temperature of the module will be:
Tcase = Tamb + Pd × Rth = 40 + 7.4 × 7.5 = 95.5 °C
This value exceeds the maximum allowed tempera-
ture and an external heat-sink must be added. To
this purpose four holes (see mechanical drawing)
are provided on the metal surface of the module.
To calculate this heat-sink, let’s first determine what
the total thermal resistance should be:
Rth = Tcase(max) Tamb = 85 40 = 5.40 °C W
Pd
7.4
This value is the resulting value of the parallel
connection of GS-R thermal resistance and of the
additional heatsink thermal resistance.
Rth (GSR) × Rth (Heatsink) = 5.40°C / W
Rth (GSR) + Rth (Heatsink)
To calculate the thermal resistance of the additional
heat-sink the following equation may be used:
Rth (Heatsink) = 5.40 × Rth (GSR) = 5.40× 7.5 = 19.3 °C / W
Rth(GSR) 5,40 7.5 5.40
In instead of or in addition to the external heatsink,
a forced ventilation with an air speed of about 200
linear feet/minute can be used reducing the thermal
resistance of the module at the specified value.
Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsibility for the
consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No
license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specification mentioned
in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied.
SGS-THOMSON Microelectronics products are not authorized for use as critical components in life support devices or systems without express
written approval of SGS-THOMSON Microelectronics.
© 1994 SGS-THOMSON Microelectronics – All Rights Reserved
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