HBTGFR421-W 데이터 시트보기 (PDF) - SEOUL SEMICONDUCTOR

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HBTGFR421-W

3- chip Full- color LED

SEOUL SEMICONDUCTOR 

11. Soldering profile

(1) Lead Solder

Pre-heat

Lead Solder

120~150℃

Pre-heat time

120 sec. Max.

Peak-Temperature 240℃ Max.

Soldering time

Condition

10 sec. Max.

2.5~5 C / sec.

Lead Solder

2.5~5o C / sec.

240 oC Max.

10 sec. Max.

Pre-heating

120~150 oC

60sec. Max.

Above 200oC

120sec. Max.

(2) Lead-Free Solder

Lead Free Solder

Pre-heat

150~200℃

Pre-heat time

120 sec. Max.

Peak-Temperature 260℃ Max.

Soldering time

Condition

10 sec. Max.

1~5 oC / sec.

Lead-frame Solder

1~5 oC / sec.

260 oC Max.

10 sec. Max.

Pre-heating

150~200 oC

60sec. Max.

Above 220 oC

120sec. Max.

(3) Hand Soldering conditions

Do not exceed 3 seconds at maximum 280ºC under soldering iron.

Note : In case that the soldered products are reused in soldering process,

we don’t guarantee the products.

Rev. 02

July 2012

WWW.SEOULSEMICON.COM

서식번호 : SSC-QP-7-07-25 (Rev.0.0)

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