HCPL-354 데이터 시트보기 (PDF) - Avago Technologies
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HCPL-354 Datasheet PDF : 6 Pages
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Package Outline Drawing
HCPL-354-000E
2.54
± 0.25
354
LEAD
FREE
Y WW
DATE CODE
4.40 ± 0.2
RANK
DIMENSIONS IN MILLIMETERS.
HCPL-354-060E
2.54
± 0.25
354 V
DATE CODE
LEAD
FREE
Y WW
4.40 ± 0.2
RANK
DIMENSIONS IN MILLIMETERS.
3.60 ± 0.3
2.00 ± 0.2
0.40 ± 0.1
0.10 ± 0.1
3.60 ± 0.3
2.00 ± 0.2
0.40 ± 0.1
0.10 ± 0.1
5.30 ± 0.3
7.00
+ 0.2
– 0.7
5.30 ± 0.3
7.00
+ 0.2
– 0.7
Solder Reflow Temperature Profile
1) One-time soldering reflow is rec-
ommended within the condition
of temperature and time profile
shown at right.
2) When using another soldering
method such as infrared ray lamp,
the temperature may rise partially
in the mold of the device. Keep the
temperature on the package of the
device within the condition of (1)
above.
150°C
250°C
217°C
200°C
30 seconds
260°C (Peak Temperature)
60 sec
25°C
60 ~ 150 sec
90 sec
Time (sec)
Note: Non-halide flux should be used.
60 sec
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