HI5702 데이터 시트보기 (PDF) - Intersil

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HI5702

10-Bit, 40 MSPS A/D Converter

Intersil 

Die Characteristics

DIE DIMENSIONS:

159.4 mils x 175.2 mils x 19 mils ±1 mil

METALLIZATION:

Type: AlSiCu

Thickness: 11kÅ ±1kÅ

SUBSTRATE POTENTIAL (Powered Up):

GND (0.0V)

PASSIVATION:

Type: Sandwich Passivation

Nitride + Undoped Silicon Glass (USG)

Thickness: Nitride 4.2kÅ, USG 8kÅ

Total 12.2kÅ ±2kÅ

Metallization Mask Layout

HI5702

WORST CASE CURRENT DENSITY:

1.6 x 104 A/cm2

TRANSISTOR COUNT:

4514

DIE DIMENSIONS:

Silver Filled Epoxy

HI5702

AVCC

AGND

VREF+

VREF-

VIN-

VIN+

D4

DVCC

CLK

DGND

D5

D6

4-1517

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