NX26F080A 데이터 시트보기 (PDF) - NexFlash -> Winbond Electronics

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NX26F080A

8M-BIT AND 16M-BIT SERIAL FLASH MEMORY WITH 2-PIN NXS INTERFACE

NexFlash -> Winbond Electronics 

NX26F080A

NX26F160

PACKAGE INFORMATION

Plastic TSOP - 24/28-pins

Package Code: T (Type II)

N

N/2+1

E

1

N/2

D

SEATING PLANE

A

e

B

A1

H

L

α

C

Plastic TSOP (T—Type II)

Millimeters

Inches

Symbol Min Max

Min Max

Ref. Std.

No. Leads

24/28

A 1.00 1.20

0.039 0.047

A1 0.05 0.20

0.002 0.008

B 0.36 0.51

0.014 0.020

C 0.10 0.20

0.004 0.008

D 18.31 18.52 0.721 0.729

E 10.06 10.26 0.396 0.404

H 11.74 11.94 0.462 0.047

e

1.27 BSC

0.050 BSC

L 0.43 0.584 0.017 0.023

α

0°

5°

0°

5°

12

Notes:

1. Controlling dimension: millimeters, unless

otherwise specified.

2. BSC = Basic lead spacing between centers.

3. Dimensions D and E1 do not include mold

flash protrusions and should be measured

from the bottom of the package.

4. Formed leads shall be planar with respect

to one another within 0.004 inches at the

seating plane.

NexFlash Technologies, Inc.

PRELIMINARY NXSF006E-0801

08/22/01 ©

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