Package and PCB thermal data
4
Package and PCB thermal data
4.1
SO-8 thermal data
Figure 5. SO-8 PC board
L4979D, L4979MD
*$3*&)7
1.
Layout condition of Rth and Zth measurements (PCB: FR4
Cu thickness = 35 mm, Copper areas: from minimum pad
area = 58
lay-out to
mm x 58
2cm2).
mm,
PCB
thickness
=
2
mm,
Figure 6. Rthj-amb vs PCB copper area in open box free air condition
24(J?AMB VS #U HEATSINK AREA
24(JAMB
0#" #U HEATSINK AREA CM>
'!0'#&4
12/22
Doc ID 10262 Rev 9