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L4979D 데이터 시트보기 (PDF) - STMicroelectronics

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L4979D
ST-Microelectronics
STMicroelectronics ST-Microelectronics
L4979D Datasheet PDF : 22 Pages
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Package and PCB thermal data
4
Package and PCB thermal data
4.1
SO-8 thermal data
Figure 5. SO-8 PC board
L4979D, L4979MD
*$3*&)7
1.
Layout condition of Rth and Zth measurements (PCB: FR4
Cu thickness = 35 mm, Copper areas: from minimum pad
area = 58
lay-out to
mm x 58
2cm2).
mm,
PCB
thickness
=
2
mm,
Figure 6. Rthj-amb vs PCB copper area in open box free air condition
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12/22
Doc ID 10262 Rev 9

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