LH28F008SCT-12 데이터 시트보기 (PDF) - Sharp Electronics

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LH28F008SCT-12

Flash Memory 8M (1M ×8)

Sharp Electronics 

SHARP

LHFOSCH3

41

8 Package and packing specification )

1. Package Outline Specification

Refer to drawing No.AAl

10 5

2. Markings

2 - 1. Marking contents

( 1 ) Product name :

( 2 ) Company name :

( 3 ) Date code

(Example)

YY

LH28F008SCT-L

SHARP

ww

xxx

12

Indicates the product was manufactured

(01,02,03, * - - * * 52,53)

- Denotes the product ion year.

(Lower two digit of the year.)

- Denotes the product ion ref.code

(No marking , A , B , c>

(4) “JAPAN” is marked on the package when both wafer and assemb ly processes are

done in Japan , indicating the country of origin.

2-2. Marking layout

Refer drawing No.AAl 10 5

(This layout does not define the dimensions of marking character and marking position.)

3. Packing Specification (Dry packing for surface mount packages)

Dry packing is used for the purpose of maintaining IC quality after mounting

packages on the PCB (Printed Circuit Board).

When the epoxy resin which is used for plastic packages is stored at high

humidity, it may absorb 0.15% or more of its weight in moisture. If the surface

mount type package for a relatively large chip absorbs a large amount of moisture

between the epoxy resin and insert material (e.g. chip, lead frame) this moisture

may suddenly vaporize into steam when the entire package is heated during the

soldering process (e.g. VPS). This causes expansion and results in separation

between the resin and insert material, and sometimes cracking of the package.

This dry packing is designed to prevent the above problem from occurring in

surface mount packages.

3 - 1 . Packing Materials

Material Name

Material Specificaiton

Purpose

Tray

Conductive plastic (50devices/tray)

Fixing of device

_-_U_p_p_e_r___c_o_v-e--r-_-_t_ra~y~~----.--~~~.~C..~o-n-d.~u~c-t-i-v-e-----~~p~la-~st-i.c----~~~~~~(~lt-r~a~y-/c--a--s-e-.)..~~.~.~~~F~ix~i~n~g....~.o~f~~~d~e.v..i.c.~e~~-~...~~~~~--.-~~~~~------~~~~~..~~~~~~........

Laminated aluminum ._b_a-.g-._-A_l_u.m...i.n._u-m_~~~p.o..l.y..e..t.h..y~l~e~n~e...........-(.l.b--a..g--/c-~a~s-e-)-~....~~~D~r-y..i.n-~g~~~o~f----d~e-~v~ic~e...~-~~~......-----.~....-~~~~~~~

_...D..e_s--i_cc--a-_n_t _......--~~.~.~......-~..-.--~S~il~ic~a....~--g~e~l~~~~........--~~~~~~~~.--...............~~.~..D..r..y.~in~g.-..-~o~f~--d--e-v--i~ce~...~---~.....-..---.....---------

___P__P._-b_a--n--d..-____..------~~.......~~~P~.o--ly--p~r~o~p~y~le~n~e~----.~~~~~~.~~.----(-3--p-~cs~/-c~a~s~e~) ~~~~~~F.i~x~in..g...~~~o~f ~..t.r.a.~y.~~.-.~.~~~~------~~~~---.~~.~...----~.....-.------

___In_n_e_r_-.-.c..a..s-_e___..---~--~~.......~-~C~a.~rd.----b--o~a.~rd~~---.------~--.--(~5.0--0-d..e-.v..i.c..e..s./.c..a..s..e..)..~.... _.P..a..c..k_a._g_in..g....__o~f.~~d~e~vi.c~e~..~~~~~.....~~~~~....~...~

Label

Paper

Indicates part number, quantity

and date of manufacture

Outer case

Card board

(Devices shall be placed into a tray in the same direction.)

Outer packing of tray

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