PACKAGE DESCRIPTION
N8 Package
8-Lead PDIP (Narrow .300 Inch)
(Reference LTC DWG # 05-08-1510)
.400*
(10.160)
MAX
8
7
6
5
.255 ± .015*
(6.477 ± 0.381)
.300 – .325
(7.620 – 8.255)
12
.045 – .065
(1.143 – 1.651)
34
.130 ± .005
(3.302 ± 0.127)
.008 – .015
(0.203 – 0.381)
.065
(1.651)
TYP
+.035
.325 –.015
( ) 8.255
+0.889
–0.381
.100
(2.54)
BSC
NOTE:
1. DIMENSIONS
ARE
INCHES
MILLIMETERS
*THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .010 INCH (0.254mm)
.120
(3.048)
MIN
.018 ± .003
(0.457 ± 0.076)
.020
(0.508)
MIN
N8 1002
S8 Package
8-Lead Plastic Small Outline (Narrow .150 Inch)
(Reference LTC DWG # 05-08-1610)
.050 BSC
N
.245
MIN
12 3
.045 ±.005
.189 – .197
(4.801 – 5.004)
NOTE 3
8
7
6
5
N
.160 ±.005
.228 – .244
(5.791 – 6.197)
N/2
.150 – .157
(3.810 – 3.988)
NOTE 3
N/2
.030 ±.005
TYP RECOMMENDED SOLDER PAD LAYOUT
1
2
34
.010
(0.254
–
–
.020
0.508)
×
45°
.008 – .010
(0.203 – 0.254)
0°– 8° TYP
.053 – .069
(1.346 – 1.752)
.004 – .010
(0.101 – 0.254)
.016 – .050
(0.406 – 1.270)
NOTE:
1. DIMENSIONS
IN
INCHES
(MILLIMETERS)
.014 – .019
(0.355 – 0.483)
TYP
2. DRAWING NOT TO SCALE
3. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006" (0.15mm)
.050
(1.270)
BSC
SO8 0502
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
LT1636
1636fc
15