LT3580I 데이터 시트보기 (PDF) - Linear Technology

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LT3580I

Boost/Inverting DC/DC Converter with 2A Switch, Soft-Start, and Synchronization

Linear Technology 

APPLICATIONS INFORMATION

LT3580

1

C1

2

VIN

3

L1

4

SW

D1 C2

VOUT

GND

8

9

7

6

5

SYNC

SHDN

3580 F09

VIAS TO GROUND

PLANE REQUIRED

TO IMPROVE

THERMAL

PERFORMANCE

Figure 9. Suggested Component Placement for Boost Topology

(Both DFN and MSOP Packages. Not to Scale). Pin 9 (Exposed

Pad) Must Be Soldered Directly to the Local Ground Plane for

Adequate Thermal Performance. Multiple Vias to Additional

Ground Planes Will Improve Thermal Performance

GND

C1

VIN

L1

SW

1

8

2

9

7

3

6

4

5

SYNC

SHDN

L2

C2

D1 C3

VOUT

3580 F10

VIAS TO GROUND

PLANE REQUIRED

TO IMPROVE

THERMAL

PERFORMANCE

Figure 10. Suggested Component Placement for Sepic Topology

(Both DFN And MSOP Packages. Not to Scale). Pin 9 (Exposed

Pad) Must Be Soldered Directly to the Local Ground Plane for

Adequate Thermal Performance. Multiple Vias to Additional

Ground Planes Will Improve Thermal Performance

GND

1

C1

2

VIN

3

4

L1

SW

L2

C2

D1

C3

VOUT

8

9

7

6

5

SYNC

SHDN

3580 F11

VIAS TO GROUND

PLANE REQUIRED

TO IMPROVE

THERMAL

PERFORMANCE

Figure 11. Suggested Component Placement for Inverting Topology (Both DFN and MSOP Packages. Not to Scale).

Note Cut in Ground Copper at Diode’s Cathode. Pin 9 (Exposed Pad) Must be Soldered Directly to Local Ground

Plane for Adequate Thermal Performance. Multiple Vias to Additional Ground Planes Will Improve Thermal

Performance

3580fg

17

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