M25P16 데이터 시트보기 (PDF) - Numonyx -> Micron
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M25P16 Datasheet PDF : 55 Pages
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M25P16
13 Revision history
Revision history
Table 23. Document revision history
Date
Revision
Changes
16-Jan-2002 0.1 Target Specification Document written
Clarification of descriptions of entering Standby Power mode from Deep
Power-down mode, and of terminating an instruction sequence or data-
23-Apr-2002
0.4
out sequence.
ICC2(max) value changed to 10µA
Typical Page Program time improved. Write Protect setup and hold times
13-Dec-2002
0.5
specified, for applications that switch Write Protect to exit the Hardware
Protection mode immediately before a WRSR, and to enter the Hardware
Protection mode again immediately after
0.6 MLP8 package added
15-May-2003
0.7 50MHz operation, and RDID instruction added. Published internally, only
20-Jun-2003 0.8 8x6 MLP8 and SO16(300 mil) packages added
24-Sep-2003
1.0
tPP, tSE and tBE revised. SO16 package code changed. Output Timing
Reference Voltage changed. Document promoted to Preliminary Data.
Table of contents, warning about exposed paddle on MLP8, and Pb-free
options added.
24-Nov-2003 2.0
Value of tVSL(min) and tBE(typ) changed. Change of naming for VDFPN8
packages. Document promoted to full Datasheet.
17-May-2004
3.0
MLP8(5x6) package removed. Soldering temperature information
clarified for RoHS compliant devices. Device Grade clarified
Notes 1 and 2 removed from Table 22: Ordering information scheme.
Small text changes.
01-Apr-2005
4.0
Read Identification (RDID), Deep Power-down (DP) and Release from
Deep Power-down and Read Electronic Signature (RES) instructions,
and Active Power, Standby Power and Deep Power-down modes
paragraph clarified.
01-Aug-2005
5.0
Updated Page Program (PP) instructions in Page programming, Page
Program (PP) and Table 15: AC characteristics (Grade 6).
VFQFPN8 package added (see Figure 27: VFQFPN8 (MLP8) 8-lead very
thin fine pitch quad flat package no lead, 6 × 5 mm, package outline and
Table 17: VFQFPN8 (MLP8) 8-lead very thin fine pitch quad flat package
20-Oct-2005
6.0
no lead, 6 × 5 mm, package mechanical data).
All packages are ECOPACK®. “Blank” option removed under Plating
Technology.
SO8 Narrow and SO8 Wide packages added (see Section 11: Package
mechanical). VDFPN8 package updated (see Table 18: VDFPN8 (MLP8)
27-Feb-2006
7
8-lead very thin dual flat package no lead, 8 × 6 mm, package
mechanical data). Note 1 added to Table 22: Ordering information
scheme.
04-Jul-2006
Figure 4: Bus master and memory devices on the SPI bus updated and
8
Note 2 added. SO8N package specifications updated (see Figure 29 and
Table 19). Small text changes.
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