MACH220-10 데이터 시트보기 (PDF) - Advanced Micro Devices

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MACH220-10

High-Density EE CMOS Programmable Logic

Advanced Micro Devices 

TYPICAL THERMAL CHARACTERISTICS

Measured at 25°C ambient. These parameters are not tested.

Parameter

Symbol

θjc

θja

θjma

Parameter Description

Thermal impedance, junction to case

Thermal impedance, junction to ambient

Thermal impedance, junction to

ambient with air flow

200 lfpm air

400 lfpm air

600 lfpm air

800 lfpm air

AMD

Typ

PLCC

10

33

29

27

24

23

Units

°C/W

°C/W

°C/W

°C/W

°C/W

°C/W

Plastic θjc Considerations

The data listed for plastic θjc are for reference only and are not recommended for use in calculating junction temperatures. The

heat-flow paths in plastic-encapsulated devices are complex, making the θjc measurement relative to a specific location on the

package surface. Tests indicate this measurement reference point is directly below the die-attach area on the bottom center of the

package. Furthermore, θjc tests on packages are performed in a constant-temperature bath, keeping the package surface at a

constant temperature. Therefore, the measurements can only be used in a similar environment.

MACH220-10/12/15/20

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