MC33201(2004) 데이터 시트보기 (PDF) - ON Semiconductor

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MC33201
(Rev.:2004)

Low Voltage, Rail-to-Rail Operational Amplifiers

ON Semiconductor 

MC33201, MC33202, MC33204, NCV33202, NCV33204

PACKAGE DIMENSIONS

−A−

K

−B−

Micro8

DM SUFFIX

CASE 846A−02

ISSUE F

PIN 1 ID G

D 8 PL

0.08 (0.003) M T B S A S

SEATING

−T− PLANE

0.038 (0.0015)

C

H

J

L

STYLE 1:

PIN 1. SOURCE

2. SOURCE

3. SOURCE

4. GATE

5. DRAIN

6. DRAIN

7. DRAIN

8. DRAIN

STYLE 2:

PIN 1. SOURCE 1

2. GATE 1

3. SOURCE 2

4. GATE 2

5. DRAIN 2

6. DRAIN 2

7. DRAIN 1

8. DRAIN 1

STYLE 3:

PIN 1. N−SOURCE

2. N−GATE

3. P−SOURCE

4. P−GATE

5. P−DRAIN

6. P−DRAIN

7. N−DRAIN

8. N−DRAIN

SOLDERING FOOTPRINT*

1.04

8X 0.041

0.38

0.015 8X

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSION A DOES NOT INCLUDE MOLD FLASH,

PROTRUSIONS OR GATE BURRS. MOLD FLASH,

PROTRUSIONS OR GATE BURRS SHALL NOT

EXCEED 0.15 (0.006) PER SIDE.

4. DIMENSION B DOES NOT INCLUDE INTERLEAD

FLASH OR PROTRUSION. INTERLEAD FLASH OR

PROTRUSION SHALL NOT EXCEED 0.25 (0.010)

PER SIDE.

5. 846A−01 OBSOLETE, NEW STANDARD 846A−02.

MILLIMETERS

INCHES

DIM MIN MAX MIN MAX

A 2.90 3.10 0.114 0.122

B 2.90 3.10 0.114 0.122

C −−− 1.10 −−− 0.043

D 0.25 0.40 0.010 0.016

G

0.65 BSC

0.026 BSC

H 0.05 0.15 0.002 0.006

J 0.13 0.23 0.005 0.009

K 4.75 5.05 0.187 0.199

L 0.40 0.70 0.016 0.028

3.20

0.126

4.24 5.28

0.167 0.208

0.65

6X 0.0256

Micro8E

ǒ Ǔ SCALE 8:1

mm

inches

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

http://onsemi.com

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