MC33501(2002) 데이터 시트보기 (PDF) - ON Semiconductor

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MC33501
(Rev.:2002)

1.0 V, Rail−to−Rail, Single Operational Amplifiers

ON Semiconductor 

MC33501, MC33503

PACKAGE DIMENSIONS

SOT23–5

(TSOP–5, SC59–5)

SN SUFFIX

CASE 483–01

ISSUE B

D

5

4

S 1 23

B

L

G

A

C

0.05 (0.002)

H

J

K

M

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. MAXIMUM LEAD THICKNESS INCLUDES LEAD

FINISH THICKNESS. MINIMUM LEAD THICKNESS

IS THE MINIMUM THICKNESS OF BASE

MATERIAL.

MILLIMETERS

INCHES

DIM MIN MAX MIN MAX

A 2.90 3.10 0.1142 0.1220

B 1.30 1.70 0.0512 0.0669

C 0.90 1.10 0.0354 0.0433

D 0.25 0.50 0.0098 0.0197

G 0.85 1.05 0.0335 0.0413

H 0.013 0.100 0.0005 0.0040

J 0.10 0.26 0.0040 0.0102

K 0.20 0.60 0.0079 0.0236

L 1.25 1.55 0.0493 0.0610

M

0 _ 10_ 0_ 10_

S 2.50 3.00 0.0985 0.1181

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