MPX5100D 데이터 시트보기 (PDF) - Motorola => Freescale
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MPX5100D
Motorola => Freescale
MPX5100D Datasheet PDF : 12 Pages
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Freescale Semiconductor, Inc.
MPX5100/MPXV5100 SERIES
ON-CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONING
Figure 2 shows the sensor output signal relative to pressure
input. Typical, minimum, and maximum output curves are
shown for operation over a temperature range of 0° to 85°C
using the decoupling circuit shown in Figure 4. The output will
saturate outside of the specified pressure range.
Figure 3 illustrates both the Differential/Gauge and the Abso-
lute Sensing Chip in the basic chip carrier (Case 867). A fluoro-
silicone gel isolates the die surface and wire bonds from the
environment, while allowing the pressure signal to be transmit-
ted to the sensor diaphragm.
The MPX5100/MPXV5100 series pressure sensor operating
characteristics, and internal reliability and qualification tests are
based on use of dry air as the pressure media. Media, other
than dry air, may have adverse effects on sensor performance
and long-term reliability. Contact the factory for information re-
garding media compatibility in your application.
Figure 4 shows the recommended decoupling circuit for in-
terfacing the output of the integrated sensor to the A/D input of
a microprocessor or microcontroller. Proper decoupling of the
power supply is recommended.
Figure 1.
Transfer Function MPX5100D/MPX5100G/MPXV5100G Series
5
Vout = VS x (0.009 x P + 0.04)
± (Pressure Error x Temperature Factor x 0.009 x VS)
VS = 5.0 V ± 0.25 Vdc
4 PE = 2.5
TM = 1
Temperature = 0–85°C
3
2
MAX
1
TYPICAL
MIN
0
0 10 20 30 40 50 60 70 80 90 100 110
PRESSURE (kPa)
Figure 2. Output versus Pressure Differential
OFFSET
(TYP)
FLUORO SILICONE
GEL DIE COAT
DIE
WIRE BOND
STAINLESS STEEL
METAL COVER
FLUORO SILICONE
GEL DIE COAT
DIE
EPOXY PLASTIC
CASE
WIRE BOND
STAINLESS STEEL
METAL COVER
EPOXY PLASTIC
CASE
LEAD FRAME
DIFFERENTIAL/GAUGE ELEMENT
DIE
BOND
LEAD FRAME
Figure 3. Cross-Sectional Diagrams
(Not to Scale)
ABSOLUTE ELEMENT
+5 V
Vout
VS
OUTPUT
IPS
1.0 µF
0.01 µF
GND
470 pF
Figure 4. Recommended Power Supply Decoupling and Output Filtering
(For additional output filtering, please refer to Application Note AN1646)
DIE
BOND
MOTOROLA
Motorola Sensor Device Data
3
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