MPX5100D 데이터 시트보기 (PDF) - Motorola => Freescale

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MPX5100D

Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated

Motorola => Freescale 

Freescale Semiconductor, Inc.

MPX5100/MPXV5100 SERIES

PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE

Motorola designates the two sides of the pressure sensor as

the Pressure (P1) side and the Vacuum (P2) side. The Pressure

(P1) side is the side containing fluoro silicone gel which protects

the die from harsh media. The Motorola MPX pressure sensor

is designed to operate with positive differential pressure

applied, P1 > P2.

The Pressure (P1) side may be identified by using the Table

below:

Part Number

MPX5100A, MPX5100D

MPX5100DP

MPX5100AP, MPX5100GP

MPX5100GSX

MPXV5100GC6U

MPXV5100GC7U

Case Type

867

867C

867B

867F

482A

482C

Pressure (P1) Side Identifier

Stainless Steel Cap

Side with Part Marking

Side with Port Attached

Side with Port Attached

Side with Port Attached

Side with Port Attached

ORDERING INFORMATION

The MPX5100/MPXV5100 pressure sensor is available in absolute, differential, gauge, and vacuum configurations.

Devices are available in the basic element package or with pressure port fittings that provide printed circuit board mount-

ing ease and barbed hose pressure connections.

Device Name

Basic Element

Ported Elements

Options

Absolute

Differential

Differential Dual Ports

Absolute, Single Port

Gauge, Single Port

Gauge, Axial PC Mount

Gauge, Axial Port, SMT

Gauge, Axial Port, DIP

Case Type

867

867

867C

867B

867B

867F

482A

482C

MPX Series

Order Number

Device Marking

MPX5100A

MPX5100A

MPX5100D

MPX5100D

MPX5100DP

MPX5100DP

MPX5100AP

MPX5100AP

MPX5100GP

MPX5100GP

MPX5100GSX

MPX5100D

MPXV5100GC6U

MPXV5100G

MPXV5100GC7U

MPXV5100G

INFORMATION FOR USING THE SMALL OUTLINE PACKAGE (CASE 482)

MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS

Surface mount board layout is a critical portion of the total

the packages will self align when subjected to a solder reflow

design. The footprint for the surface mount packages must be

process. It is always recommended to design boards with a

the correct size to ensure proper solder connection interface

solder mask layer to avoid bridging and shorting between solder

between the board and the package. With the correct footprint,

pads.

0.660

16.76

0.100 TYP 8X

2.54

0.060 TYP 8X

1.52

0.300

7.62

0.100 TYP 8X

2.54

inch

mm SCALE 2:1

Figure 5. SOP Footprint (Case 482)

6

Motorola Sensor Device Data

MOTOROLA

For More Information On This Product,

Go to: www.freescale.com

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