128M16 데이터 시트보기 (PDF) - Micron Technology

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128M16

DDR3 SDRAM

Micron Technology 

2Gb: x4, x8, x16 DDR3 SDRAM

Ball Assignments and Descriptions

Table 4: 96-Ball FBGA – x16 Ball Descriptions (Continued)

Symbol

UDM

DQ[7:0]

DQ[15:8]

LDQS, LDQS#

UDQS, UDQS#

VDD

VDDQ

VREFCA

VREFDQ

VSS

VSSQ

ZQ

NC

Type Description

Input

I/O

I/O

I/O

Input data mask: UDM is an upper-byte, input mask signal for write data. Upper-byte

input data is masked when UDM is sampled HIGH along with that input data during a

WRITE access. Although the UDM ball is input-only, the UDM loading is designed to

match that of the DQ and DQS balls. UDM is referenced to VREFDQ.

Data input/output: Lower byte of bidirectional data bus for the x16 configuration.

DQ[7:0] are referenced to VREFDQ.

Data input/output: Upper byte of bidirectional data bus for the x16 configuration.

DQ[15:8] are referenced to VREFDQ.

Lower byte data strobe: Output with read data. Edge-aligned with read data. Input

with write data. Center-aligned to write data.

I/O

Upper byte data strobe: Output with read data. Edge-aligned with read data. Input

with write data. DQS is center-aligned to write data.

Supply Power supply: 1.5V ±0.075V.

Supply DQ power supply: 1.5V ±0.075V. Isolated on the device for improved noise immunity.

Supply Reference voltage for control, command, and address: VREFCA must be main-

tained at all times (including self refresh) for proper device operation.

Supply Reference voltage for data: VREFDQ must be maintained at all times (excluding self

refresh) for proper device operation.

Supply Ground.

Supply DQ ground: Isolated on the device for improved noise immunity.

Reference

–

External reference ball for output drive calibration: This ball is tied to external

240Ω resistor RZQ, which is tied to VSSQ.

No connect: These balls should be left unconnected (the ball has no connection to the

DRAM or to other balls).

PDF: 09005aef826aaadc

2Gb_DDR3_SDRAM.pdf - Rev. Q 04/13 EN

21

Micron Technology, Inc. reserves the right to change products or specifications without notice.

‹ 2006 Micron Technology, Inc. All rights reserved.

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