Package Dimensions
512Mb: x16, x32 Mobile LPDDR SDRAM
Package Dimensions
Figure 6: 60-Ball VFBGA (8mm x 9mm), Package Code: BF
60X Ø0.45
Dimensions apply to
solder balls post-reflow
on Ø0.40 SMD ball pads.
Solder ball material: SAC105
(98.5% Sn, 1% Ag, 0.5% Cu).
987
9 ±0.1
7.2 CTR
0.8 TYP
A
Ball A1 ID
(covered by SR)
32 1
A
B
C
D
E
F
G
H
J
K
Seating plane
0.12 A
0.8 TYP
6.4 CTR
8 ±0.1
Note: 1. All dimensions are in millimeters.
0.9 ±0.1
0.275 MIN
Ball A1 ID
PDF: 09005aef83dd2b3e
t67m_512mb_mobile_lpddr.pdf - Rev. H 06/13 EN
15
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