MT48H16M16LFB5-8G 데이터 시트보기 (PDF) - Micron Technology
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MT48H16M16LFB5-8G Datasheet PDF : 71 Pages
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Package Dimensions
Figure 52: 90-Ball VFBGA (8mm x 13mm)
0.65 ±0.05
SEATING PLANE
A
0.10 A
90X Ø0.45
DIMENSIONS APPLY
TO SOLDER BALLS POST
6.40
REFLOW. THE PRE-
REFLOW DIAMETER IS
0.42 ON A 0.40 SMD
BALL PAD
BALL A9
0.80 TYP
BALL A1 ID
BALL A1
SOLDER BALL MATERIAL:
96.5% Sn, 3%Ag, 0.5% Cu
SUBSTRATE MATERIAL:
PLASTIC LAMINATE
MOLD COMPOUND:
EPOXY NOVOLAC
BALL A1 ID
11.20 ±0.10
5.60 ±0.05
CL
13.00 ±0.10
6.50 ±0.05
CL
3.20
4.00 ±0.05
8.00 ±0.10
Notes: 1. All dimensions are in millimeters.
1.00 MAX
®
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prodmktg@micron.com www.micron.com Customer Comment Line: 800-932-4992
Micron, the M logo, and the Micron logo are trademarks of Micron Technology, Inc.
All other trademarks are the property of their respective owners.
This data sheet contains minimum and maximum limits specified over the complete power supply and temperature range
for production devices. Although considered final, these specifications are subject to change, as further product
development and data characterization sometimes occur.
PDF:09005aef8219eeeb/Source: 09005aef8219eedd
MT48H16M16LF_2.fm - Rev F 4/07 EN
71
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2006 Micron Technology, Inc. All rights reserved.
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