NBSG16VS 데이터 시트보기 (PDF) - ON Semiconductor

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NBSG16VS

2.5V/3.3V SiGe Differential Receiver/Driver with Variable Output Swing

ON Semiconductor 

NBSG16VS

PACKAGE DIMENSIONS

LASER MARK FOR PIN 1

IDENTIFICATION IN

THIS AREA

−X−

−Y−

E

FCBGA−16

BA SUFFIX

PLASTIC 4X4 (mm) BGA FLIP CHIP PACKAGE

CASE 489−01

ISSUE O

D

M

K

0.20

3X e

S

M

4321

FEDUCIAL FOR PIN A1

IDENTIFICATION IN THIS AREA

A

B

C

D

VIEW M−M

3

16 X b

0.15 M Z X Y

0.08 M Z

NOTES:

1. DIMENSIONS ARE IN MILLIMETERS.

2. INTERPRET DIMENSIONS AND TOLERANCES

PER ASME Y14.5M, 1994.

3. DIMENSION b IS MEASURED AT THE MAXIMUM

SOLDER BALL DIAMETER, PARALLEL TO DATUM

PLANE Z.

4. DATUM Z (SEATING PLANE) IS DEFINED BY THE

SPHERICAL CROWNS OF THE SOLDER BALLS.

5. PARALLELISM MEASUREMENT SHALL EXCLUDE

ANY EFFECT OF MARK ON TOP SURFACE OF

PACKAGE.

MILLIMETERS

DIM MIN MAX

A

1.40 MAX

A1 0.25 0.35

A2 1.20 REF

b 0.30 0.50

D

4.00 BSC

E

4.00 BSC

e

1.00 BSC

S

0.50 BSC

A A2

5

0.15 Z

A1

4

16 X

0.10 Z

DETAIL K

ROTATED 90 _CLOCKWISE

−Z−

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