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CXD1175AM 데이터 시트보기 (PDF) - Sony Semiconductor
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CXD1175AM
8-bit 20MSPS Video A/D Converter (CMOS)
Sony Semiconductor
CXD1175AM Datasheet PDF : 20 Pages
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Package Outline
Unit: mm
CXD1175AM
24PIN SOP (PLASTIC)
+ 0.4
15.0 – 0.1
24
13
+ 0.4
1.85 – 0.15
0.15
+ 0.2
0.1 – 0.05
1
0.45 ± 0.1
12
1.27
+ 0.1
0.2 – 0.05
± 0.12 M
SONY CODE
EIAJ CODE
JEDEC CODE
SOP-24P-L01
∗
SOP024-P-0300-A
PACKAGE STRUCTURE
MOLDING COMPOUND EPOXY/PHENOL RESIN
LEAD TREATMENT
SOLDER PLATING
LEAD MATERIAL
COPPER ALLOY / 42ALLOY
PACKAGE WEIGHT
0.3g
CXD1175AP
24
24PIN DIP(PLASTIC)
+ 0.4
30.2 – 0.1
13
1
12
2.54
0° to 15°
CXD1175AM/AP
0.5 ± 0.1
1.2 ± 0.15
SONY CODE
EIAJ CODE
JEDEC CODE
DIP-24P-01
DIP024-P-0400
Two kinds of package surface:
1.All mat surface type.
2.All mirror surface type.
PACKAGE STRUCTURE
PACKAGE MATERIAL EPOXY RESIN
LEAD TREATMENT
SOLDER PLATING
LEAD MATERIAL
42/COPPER ALLOY
PACKAGE MASS
2.0g
– 20 –
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