HTG2150(2000) 데이터 시트보기 (PDF) - Holtek Semiconductor
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HTG2150 Datasheet PDF : 49 Pages
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Preliminary
HTG2150
Pad No. Pad Name
13
INT/SEG37
15
XIN/SEG39
14
XOUT/SEG38
16
RES
17
PWM1
18
PWM2
19
VDD
20
OSCI
21
VSS
22~29 PA0~PA7
37~31 COM7~COM0
I/O
I
or
O
I or O
O
I
O
O
¾
I
¾
I/O
O
Mask
Option
Description
Selectable as external interrupt schmitt trigger
Interrupt input or LCD segment 37 signal output by mask
input or option. External interrupt schmitt trigger input
Segment 37 with pull-high resistor. Edge triggered activated
output on a high to low transition. INT shares pad with
SEG37.
Crystal or
Segment
Output
Selectable as 32768Hz crystal oscillator or LCD
segment signal output by mask option. Crystal
oscillator (32.768kHz) for Timer 3 and LCD
clock. XIN shares pad with SEG39; XOUT
shares pad with SEG38.
¾
Schmitt trigger reset input. Active low without
pull-high resistor.
CMOS Positive PWM CMOS output
CMOS Negative PWM CMOS output
¾
Positive power supply
¾
OSCI is connected to the RC network of the in-
ternal system clock.
¾
Negative power supply, ground
Wake-up
or None
Wake-up
Bidirectional 8-bit input/output port. Each bit
can be configured as a wake-up input by mask
option. Software instructions determine the
CMOS output or schmitt trigger input with
pull-high resistor.
¾
LCD common signal output
Absolute Maximum Ratings
Supply Voltage..............................-0.3V to 3.6V
Input Voltage .................VSS-0.3V to VDD+0.3V
Storage Temperature.................-50°C to 125°C
Operating Temperature ..................0°C to 70°C
Note: These are stress ratings only. Stresses exceeding the range specified under ²Absolute Maxi-
mum Ratings² may cause substantial damage to the device. Functional operation of this device
at other conditions beyond those listed in the specification is not implied and prolonged expo-
sure to extreme conditions may affect device reliability.
5
July 24, 2000
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