PT2303 데이터 시트보기 (PDF) - Princeton Technology
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PT2303 Datasheet PDF : 17 Pages
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2W × 2 Class AB Audio Power Amplifier
PT2303
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M-1994.
2. Controlling Dimension: Millimeters
3. Dimension D does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate
burrs shall not exceed 0.15 per end.
4. Dimension E1 does not include interlead flash or protrusion. Interlead flash or protrusion shall not
exceed 0.25 per side.
5. Dimension b does not include dambar protrusion. Allowable dambar protrusion shall be 0.08 mm
total in excess of the b dimension at maximum material condition. Dambar cannot be located on the
lower radius or the foot. Minimum space between protrusion and adjacent lead is 0.07 mm.
6. N is the maximum number of terminal positions for the specified package length. Depopulation is
allowed, but only under the following conditions:
- Depopulation may reduce N by increments of four leads only.
- Only end leads may be removed.
- Leads must be symmetrically arranged with respect to datum A (Note 10) to avoid any array
shifting.
7. Terminal numbers are shown for reference only.
8. Datum A and B to be determined at datum plane H.
9. Dimensions D and E1 to be determined at datum plane H.
10. This dimension applies only to variations with an even number of leads per side. For variations with
an odd number of leads per side, the center lead must be coincident with the package centerline,
datum A.
11. Cross section B-B to be determined at 0.10 to 0.25 mm from the lead tip.
12. Details of the pin 1 identifier are optional, but must be located within the zone indicated.
13. D1 and E2 minimum dimensions of thermally enhanced types are variables depending on device
function (die paddle size). D1 and E2 maximum dimensions can be equal to D/E1 maximum
dimensions. End user should verify actual size of exposed thermal pad for specific device
application.
14. A1 is defined as the vertical distance from the seating plane to the lowest point on the package
body excluding the lid and or thermal enhancement on cavity down package configurations.
15. Caution should be taken during design, assembly and processing to prevent deposited board
solder from holding the leads up off the board. This is applicable to thermal enhanced variations
where A1 dimension is allowed to be zero.
16. Refer to JEDEC MO-153 Variation AC
JEDEC is the trademark of JEDEC SOLID STATE TECHNOLOGY ASSOCIATION
PT2303 V1.2
- 17 -
December, 2007
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