RF3158 데이터 시트보기 (PDF) - RF Micro Devices
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RF3158 Datasheet PDF : 26 Pages
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RF3158
PCB Design Requirements
PCB Surface Finish
The PCB surface finish used for RFMD’s qualification process is electroless nickel, immersion gold. Typical thickness is 3μinch
to 8μinch gold over 180μinch nickel.
PCB Land Pattern Recommendation
PCB land patterns for RFMD components are based on IPC-7351 standards and RFMD empirical data. The pad pattern shown
has been developed and tested for optimized assembly at RFMD. The PCB land pattern has been developed to accommodate
lead and package tolerances. Since surface mount processes vary from company to company, careful process development is
recommended.
PCB Metal Land and Solder Mask Pattern
A = 0.50 Sq. Typ.
B = 0.50 x 0.40 Typ.
C = 0.50 x 0.80
A = 0.64 Sq. Typ.
B = 0.64 x 0.54 Typ.
C = 0.64 x 0.94
D = 0.45 x 0.57 Typ.
E = 0.50 x0.40 Typ.
F = 0.55 x 0.57 Typ.
G = 0.40 x 0.57 Typ.
H = 0.57 x 0.65 Typ.
Dimensions in mm.
5.30 Typ. A
4.45 B
3.65 B
2.65 C
1.65 B
0.65 B
0.00 Typ. A
A
5.55 Typ.
4.75
0.53
A
0.25 Typ.
5.30 Typ.
4.45 Typ.
3.65 Typ.
2.65 Typ.
1.65 Typ.
0.85 Typ.
0.00 Typ.
AD
B
B
C
B
B
AD
FG A
E
E
H
E
E
FGA
4.75 Typ.
0.55 Typ.
0.04 Typ.
Metal Land Pattern
Solder Mask Pattern
Rev A2 DS070615
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.
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