RT8284GSP 데이터 시트보기 (PDF) - Richtek Technology
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RT8284GSP Datasheet PDF : 15 Pages
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(c) Copper Area = 30mm2 , θJA = 54°C/W
(d) Copper Area = 50mm2 , θJA = 51°C/W
(e) Copper Area = 70mm2 , θJA = 49°C/W
Figure 6. Themal Resistance vs. Copper Area Layout
Design
RT8284
Layout Consideration
For best performance of the RT8284, the follow layout
giidelines must be strictly followed.
` Input capacitor must be placed as close to the IC as
possible.
` SW should be connected to inductor by wide and short
trace. Keep sensitive components away from this trace.
` The feedback components must be connected as close
to the device as possible
Input capacitor must be placed
as close to the IC as possible.
GND
VIN SW GND
The feedback components
must be connected as close
to the device as possible.
CIN
RS CS
BOOT
VIN
SW
GND
8
2
7
GND
3
6
9
4
5
CSS
SS REN VIN
EN
COMP
R1
FB
CC
CP RC
COUT
L1
R2 VOUT
SW should be connected to inductor by
VOUT
wide and short trace. Keep sensitive
components away from this trace.
GND
Figure 8. PCB Layout Guide
Table 3. Suggested Capacitors for CIN and COUT
Location Component Supplier
Part No.
CIN
MURATA
GRM31CR61E106K
CIN
TDK
C3225X5R1E106K
CIN
TAIYO YUDEN
TMK316BJ106ML
COUT
COUT
MURATA
TDK
GRM31CR60J476M
C3225X5R0J476M
COUT
MURATA
GRM32ER71C226M
COUT
TDK
C3225X5R1C22M
Capacitance (μF)
10
10
10
47
47
22
22
Case Size
1206
1206
1206
1206
1210
1210
1210
DS8284-01 March 2011
www.richtek.com
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