SAA6581 데이터 시트보기 (PDF) - NXP Semiconductors.

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SAA6581

RDS/RBDS demodulator

NXP Semiconductors. 

Philips Semiconductors

RDS/RBDS demodulator

Product specification

SAA6581

dispensing. The package can be soldered after the

adhesive is cured.

Typical dwell time of the leads in the wave ranges from

3 to 4 seconds at 250 °C or 265 °C, depending on solder

material applied, SnPb or Pb-free respectively.

A mildly-activated flux will eliminate the need for removal

of corrosive residues in most applications.

MANUAL SOLDERING

Fix the component by first soldering two

diagonally-opposite end leads. Use a low voltage (24 V or

less) soldering iron applied to the flat part of the lead.

Contact time must be limited to 10 seconds at up to

300 °C. When using a dedicated tool, all other leads can

be soldered in one operation within 2 to 5 seconds

between 270 and 320 °C.

Suitability of IC packages for wave, reflow and dipping soldering methods

MOUNTING

PACKAGE(1)

Through-hole mount DBS, DIP, HDIP, RDBS, SDIP, SIL

Through-hole-

surface mount

PMFP(9)

Surface mount

BGA, LBGA, LFBGA, SQFP, SSOP-T(4),

TFBGA, VFBGA

DHVQFN, HBCC, HBGA, HLQFP, HSQFP,

HSOP, HTQFP, HTSSOP, HVQFN, HVSON,

SMS

PLCC(6), SO, SOJ

LQFP, QFP, TQFP

SSOP, TSSOP, VSO, VSSOP

SOLDERING METHOD

WAVE

suitable(3)

not suitable

REFLOW(2) DIPPING

−

suitable

not suitable −

not suitable

suitable

−

not suitable(5)

suitable

−

suitable

suitable

−

not recommended(6)(7) suitable

−

not recommended(8) suitable

−

Notes

1. For more detailed information on the BGA packages refer to the “(LF)BGA Application Note” (AN01026); order a copy

from your Philips Semiconductors sales office.

2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum

temperature (with respect to time) and body size of the package, there is a risk that internal or external package

cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the

Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.

3. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.

4. These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account

be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature

exceeding 217 °C ± 10 °C measured in the atmosphere of the reflow oven. The package body peak temperature

must be kept as low as possible.

5. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder

cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,

the solder might be deposited on the heatsink surface.

6. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.

The package footprint must incorporate solder thieves downstream and at the side corners.

7. Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is definitely not

suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

8. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than

0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

9. Hot bar soldering or manual soldering is suitable for PMFP packages.

2003 Oct 10

13

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