XC2365
XC2000 Family Derivatives
Preliminary
Package and Reliability
5
Package and Reliability
In addition to the electrical parameters, the following information ensures proper
integration of the XC236x into the target system.
5.1
Packaging
These parameters describe the housing rather than the silicon.
Table 24 Package Parameters (PG-LQFP-100)
Parameter
Symbol
Limit Values Unit Notes
Min.
Max.
Exposed Pad Dimension Ex × Ey –
6.2 × 6.2 mm –
Power Dissipation
Thermal resistance
Junction-Ambient
PDISS
–
RΘJA
–
1.0
W
–
49
K/W No thermal via1)
37
K/W 4-layer, no pad2)
22
K/W 4-layer, pad3)
1) Device mounted on a 2-layer or 4-layer board without thermal vias.
2) Device mounted on a 4-layer board with thermal vias, exposed pad not soldered.
3) Device mounted on a 4-layer board with thermal vias, exposed pad soldered to the board.
Data Sheet
94
V0.1, 2007-06
Draft Version