TMP04 데이터 시트보기 (PDF) - Analog Devices
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TMP04 Datasheet PDF : 16 Pages
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1
+5V
2
TMP03/TMP04
T1 DATA (MICROSECONDS)
T2 DATA (MICROSECONDS)
+5V 2 5 6 9
12 15 16 19 +5V 2 5 6 9
12 15 16 19 +5V 2 5 6 9
12 15 16 19 +5V 2 5 6 9
12 15 16 19
Q1 Q2 Q3 Q4 Q5 Q6 Q7 Q8
20
VCC
11
LE
74HC373
1
OUT
10
GND
Q1 Q2 Q3 Q4 Q5 Q6 Q7 Q8
20
VCC
11
LE
74HC373
1
OUT
10
GND
Q1 Q2 Q3 Q4 Q5 Q6 Q7 Q8
20
VCC
11
LE
74HC373
1
OUT
10
GND
Q1 Q2 Q3 Q4 Q5 Q6 Q7 Q8
20
VCC
11
LE
74HC373
1
OUT
10
GND
31
3
2
D1 D2 D3 D4
3 478
D5 D6 D7 D8
13 14 17 18
D1 D2 D3 D4
3 478
D5 D6 D7 D8
13 14 17 18
D1 D2 D3 D4
3 478
D5 D6 D7 D8
13 14 17 18
D1 D2 D3 D4
3 478
D5 D6 D7 D8
13 14 17 18
74HC08
4
6
5
+5V
3 4 5 6 10 11 12 13 14
1MHZ
CLOCK
Q0 Q1 Q2 Q3 EN Q0 Q1 Q2 Q3
16
VCC
2
EN
74HC4520 #1
1
CLK
CLK GND RESET RESET
98 7
15
+5V
3 4 5 6 10 11 12 13 14
Q0 Q1 Q2 Q3 EN Q0 Q1 Q2 Q3
16
VCC
2
EN
74HC4520 #2
CLK CLK GND RESET RESET
19 8 7
15
+5V
0.1µF 10µF
V+
DOUT
TMP04
GND
10kΩ
74HC86
4
6
5
10pF +5V
20pF
+5V
1kΩ
12
4 T1
A
5
B
3
CLR
T2
VCC
Q
Q
16
6
7 NC
GND
8
74HC4538
20pF 3.9kΩ
+5V
15 14
12 T1
A
11
B
13
CLR
T2
10
Q
Q 9 NC
GND
8
Figure 36. A Hardware Interface for the TMP04
Monitoring Electronic Equipment
The TMP03/TMP04 are ideal for monitoring the thermal
environment within electronic equipment. For example, the
surface mounted package will accurately reflect the exact
thermal conditions which affect nearby integrated circuits. The
TO-92 package, on the other hand, can be mounted above the
surface of the board, to measure the temperature of the air
flowing over the board.
The TMP03 and TMP04 measure and convert the temperature
at the surface of their own semiconductor chip. When the
TMP03/TMP04 are used to measure the temperature of a
nearby heat source, the thermal impedance between the heat
source and the TMP03/TMP04 must be considered. Often, a
thermocouple or other temperature sensor is used to measure
the temperature of the source while the TMP03/TMP04
temperature is monitored by measuring T1 and T2. Once the
thermal impedance is determined, the temperature of the heat
source can be inferred from the TMP03/TMP04 output.
One example of using the TMP04 to monitor a high power
dissipation microprocessor or other IC is shown in Figure 37.
The TMP04, in a surface mount package, is mounted directly
beneath the microprocessor’s pin grid array (PGA) package. In
a typical application, the TMP04’s output would be connected
to an ASIC where the pulse width would be measured (see the
Hardware Interface section of this data sheet for a typical
REV. 0
–15–
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