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SST37VF010 데이터 시트보기 (PDF) - Silicon Storage Technology

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SST37VF010 Datasheet PDF : 16 Pages
First Prev 11 12 13 14 15 16
PACKAGING DIAGRAMS
512 Kbit / 1 Mbit / 2 Mbit / 4 Mbit Multi-Purpose Flash
SST37VF512 / SST37VF010 / SST37VF020 / SST37VF040
Data Sheet
Optional
Pin #1 Identifier .042
.048
TOP VIEW
.485
.495
.447
.453
2 1 32
.020 R.
MAX.
SIDE VIEW
.106
.112
.023 x 30˚
.029
.030
.040
R.
BOTTOM VIEW
.042
.048
.585 .547
.595 .553
.013
.021
.026
.400 .490
.032
BSC .530
.050
BSC.
.050
BSC.
.015 Min.
.075
.095
.026
.125
.032
.140
Note:
1. Complies with JEDEC publication 95 MS-016 AE dimensions, although some dimensions may be more stringent.
2. All linear dimensions are in inches (min/max).
3. Dimensions do not include mold flash. Maximum allowable mold flash is .008 inches.
4. Coplanarity: 4 mils.
32.PLCC.NH-ILL.2
32-PIN PLASTIC LEAD CHIP CARRIER (PLCC)
SST PACKAGE CODE: NH
Pin # 1 Identifier
1.05
0.95
.50
BSC
8.10
.270
.170
7.90
12.50
12.30
0.15
0.05
0.70
0.50
14.20
13.80
32.TSOP-WH-ILL.4
Note:
1. Complies with JEDEC publication 95 MO-142 BA dimensions, although some dimensions may be more stringent.
2. All linear dimensions are in millimeters (min/max).
3. Coplanarity: 0.1 (±.05) mm.
4. Maximum allowable mold flash is 0.15mm at the package ends, and 0.25mm between leads.
32-PIN THIN SMALL OUTLINE PACKAGE (TSOP) 8MM X 14MM
SST PACKAGE CODE: WH
©2001 Silicon Storage Technology, Inc.
14
S71151-02-000 5/01 397

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