TAT7430B
CATV 75 Ω pHEMT High Gain RF Amplifier
Applications Information
PC Board Layout
Core is .062” FR-4, єr = 4.7 at 1 MHz. Metal layers are
1-oz copper.
The pad pattern shown has been developed and tested for
optimized assembly at TriQuint Semiconductor. The PCB
land pattern has been developed to accommodate lead and
package tolerances. Since surface mount processes vary
from company to company, careful process development
is recommended.
For further technical information, Refer to
http://www.triquint.com/TAT7430B
Data Sheet: Rev B 03/08/11
© 2011 TriQuint Semiconductor, Inc.
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Disclaimer: Subject to change without notice
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