TDA7333 데이터 시트보기 (PDF) - STMicroelectronics

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TDA7333

RDS/RBDS processor

STMicroelectronics 

Package information

5

Package information

TDA7333N

In order to meet environmental requirements, ST (also) offers these devices in ECOPACK®

packages. ECOPACK® packages are lead-free. The category of second Level Interconnect

is marked on the package and on the inner box label, in compliance with JEDEC Standard

JESD97. The maximum ratings related to soldering conditions are also marked on the inner

box label.

ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.

Figure 20. TSSOP16 mechanical data and package dimensions

DIM.

MIN.

mm

TYP. MAX. MIN.

inch

TYP. MAX.

A

1.200

0.047

A1 0.050

0.150 0.002

0.006

A2 0.800 1.000 1.050 0.031 0.039 0.041

b 0.190

0.300 0.007

0.012

c 0.090

0.200 0.005

0.009

D (1) 4.900 5.000 5.100 0.114 0.118 0.122

E 6.200 6.400 6.600 0.244 0.252 0.260

E1 (1) 4.300 4.400 4.500 0.170 0.173 0.177

e

0.650

0.026

L 0.450 0.600 0.750 0.018 0.024 0.030

L1

1.000

0.039

k

0˚ (min.) 8˚ (max.)

aaa

0.100

0.004

Note: 1. D and E1 does not include mold flash or protrusions.

Mold flash or potrusions shall not exceed 0.15mm

(.006inch) per side.

OUTLINE AND

MECHANICAL DATA

TSSOP16

(Body 4.4mm)

34/36

0080338 (Jedec MO-153-AB)

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