TDA8594 데이터 시트보기 (PDF) - NXP Semiconductors.
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TDA8594 Datasheet PDF : 48 Pages
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NXP Semiconductors
15. Package outline
TDA8594
I2C-bus controlled 4 × 50 W power amplifier
DBS27P: plastic DIL-bent-SIL (special bent) power package; 27 leads (lead length 6.8 mm)
SOT827-1
non-concave
x
Dh
D
Eh
view B: mounting base side
d
A2
j
1
Z
e1
e
27
wM
bp
B
E
A L4
L3
L
L2
Qc
vM
e2
m
0
10
20 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT A A2 bp c D(1) d Dh E(1) e
mm 19
4.65 0.60
4.35 0.45
0.5 29.2 25.8
0.3 28.8 25.4
12
15.9
15.5
2
e1 e2 Eh j
L L2 L3 L4 m Q
v w x Z(1)
1
4
8
3.4
3.1
6.8
3.9 1.15 22.9
3.1 0.85 22.1
4
2.1
1.8
0.6
0.25 0.03
1.8
1.2
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
IEC
SOT827-1
---
REFERENCES
JEDEC
JEITA
---
---
EUROPEAN
PROJECTION
ISSUE DATE
03-07-29
Fig 37. Package outline SOT827-1 (DBS27P)
TDA8594_2
Product data sheet
Rev. 02 — 11 December 2007
© NXP B.V. 2007. All rights reserved.
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