TEA1532BT 데이터 시트보기 (PDF) - NXP Semiconductors.

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TEA1532BT

GreenChip II SMPS control IC

NXP Semiconductors. 

NXP Semiconductors

TEA1532BT; TEA1532CT

GreenChip II SMPS control IC

13. Package outline

SO8: plastic small outline package; 8 leads; body width 3.9 mm

SOT96-1

D

y

Z

8

c

5

E

A

X

HE

vM A

pin 1 index

1

e

A2

A1

4

bp

wM

Q

(A 3)

A

θ

Lp

L

detail X

0

2.5

5 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

A

UNIT max. A1

A2

A3

bp

c

D(1) E(2)

e

HE

L

Lp

Q

v

w

y

Z (1)

θ

mm

1.75

0.25

0.10

1.45

1.25

0.25

0.49

0.36

0.25

0.19

5.0

4.8

4.0

3.8

1.27

6.2

5.8

1.05

1.0

0.4

0.7

0.6

0.25 0.25

0.1

0.7

0.3

8o

inches

0.069

0.010

0.004

0.057

0.049

0.01

0.019 0.0100 0.20

0.014 0.0075 0.19

0.16

0.15

0.05

0.244

0.228

0.041

0.039

0.016

0.028

0.024

0.01

0.01

0.004

0.028

0.012

0o

Notes

1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.

2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.

OUTLINE

VERSION

SOT96-1

IEC

076E03

REFERENCES

JEDEC

JEITA

MS-012

EUROPEAN

PROJECTION

ISSUE DATE

99-12-27

03-02-18

Fig 13. Package outline SOT96-1 (SO8)

TEA1532BT_TEA1532CT_1

Product data sheet

Rev. 01 — 18 January 2007

© NXP B.V. 2007. All rights reserved.

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