TGA8349 데이터 시트보기 (PDF) - TriQuint Semiconductor

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TGA8349

Gain Block Amplifier

TriQuint Semiconductor 

TGA8349-SCC

MECHANICAL DRAWING

2,2860

(.0900)

0,3120

(.0122)

2,1117

4

(.0831)

0,4101

(.0161)

3,2283

(.1270)

1,6306

(.0641)

3

1,0331

2

(.0406)

1,4822

5

(.0583)

0,5373

(.0215)

1

0,2395

(.0094)

0

0

0,1681

(.0066)

7

6

0,2386

(.0093)

2,9438

(.1158)

3,4290

(.1350)

0,1295

(.0050)

3,2606

(.1283)

Units: Millimeters (inches)

Thickness: 0,1016 (0.004) (reference only)

Chip edge to bond pad dimensions are shown to center of bond pad

Chip size tolerance: ± 0,0508 (0.002)

Bond pad #1 (RF Input):

Bond pad #2 (VCTRL):

Bond pad #3 (VD):

Bond pad #4 (V+):

Bond pad #5 (RF Output):

Bond pad #6 (V –):

Bond pad #7 (V –(AUX)):

0,152 x 0,203 (0.006 x 0.008)

0,102 x 0,152 (0.004 x 0.006)

0,076 x 0,152 (0.003 x 0.006)

0,419 x 0,152 (0.016 x 0.006)

0,254 x 0,330 (0.010 x 0.013)

0,152 x 0,152 (0.006 x 0.006)

0,127 x 0,152 (0.005 x 0.006)

7

TriQuint Semiconductor, Inc. • Texas Facilities • (972) 995-8465 • www.triquint.com

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