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TGA2505 데이터 시트보기 (PDF) - TriQuint Semiconductor

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TGA2505
TriQuint
TriQuint Semiconductor TriQuint
TGA2505 Datasheet PDF : 12 Pages
First Prev 11 12
Input TFN
TGA2505
Chip Assembly & Bonding Diagram
100pF
Vd
Off chip
R=10Ω
Off chip
C=0.1μF
Output TFN
Vg
Off chip
R=10Ω
Off chip
C=0.1μF
100pF
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
11
TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com
May 2009 © Rev -

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