TJA1050 데이터 시트보기 (PDF) - Philips Electronics

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TJA1050

High speed CAN transceiver

Philips Electronics 

Philips Semiconductors

High speed CAN transceiver

Preliminary specification

TJA1050

DEFINITIONS

Data sheet status

Objective specification

This data sheet contains target or goal specifications for product development.

Preliminary specification

Product specification

This data sheet contains preliminary data; supplementary data may be published later.

This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or

more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation

of the device at these or at any other conditions above those given in the Characteristics sections of the specification

is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these

products can reasonably be expected to result in personal injury. Philips customers using or selling these products for

use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such

improper use or sale.

BARE DIE DISCLAIMER

All die are tested and are guaranteed to comply with all data sheet limits up to the point of wafer sawing for a period of

ninety (90) days from the date of Philips' delivery. If there are data sheet limits not guaranteed, these will be separately

indicated in the data sheet. There is no post waffle pack testing performed on individual die. Although the most modern

processes are utilized for wafer sawing and die pick and place into waffle pack carriers, Philips Semiconductors has no

control of third party procedures in the handling, packing or assembly of the die. Accordingly, Philips Semiconductors

assumes no liability for device functionality or performance of the die or systems after handling, packing or assembly of

the die. It is the responsibility of the customer to test and qualify their application in which the die is used.

1999 Sep 27

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